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| Compare | Image | Name | Manufacturer | Quantity | Weight(Kg) | Size(LxWxH) | Mfr | Series | Package | Product Status | Operating Temperature | Applications | Mounting Type | Package / Case | Features | Base Product Number | Frequency | Sensitivity | Voltage - Supply | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Data Interface | Number of I/O | Core Processor | Core Size | Speed | Connectivity | Peripherals | Program Memory Size | Program Memory Type | EEPROM Size | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | Voltage - I/O | Security Features | Additional Interfaces | Data Rate (Max) | Memory Size | Modulation or Protocol | Current - Receiving | Antenna Connector |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| NXP USA Inc. MCIMX6QP6AVT1AA | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6QP | Tray | Active | -40°C ~ 125°C (TJ) | Surface Mount | 624-FBGA, FCBGA | MCIMX6 | 624-FCBGA (21x21) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935318871557 | 5A992C | 8542.31.0001 | 60 | ARM® Cortex®-A9 | 1.0GHz | 4 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, DDR3L, DDR3 | Yes | HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel | 10/100/1000Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS | CAN, EBI/EMI, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART | ||||||||||||||||||||||||||
| NXP USA Inc. MCIMX6QP4AVT1AA | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6QP | Tray | Active | -40°C ~ 125°C (TJ) | Surface Mount | 624-FBGA, FCBGA | MCIMX6 | 624-FCBGA (21x21) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935324954557 | 5A992C | 8542.31.0001 | 60 | ARM® Cortex®-A9 | 1.0GHz | 4 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, DDR3L, DDR3 | Yes | HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel | 10/100/1000Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS | CAN, EBI/EMI, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART | ||||||||||||||||||||||||||
| NXP USA Inc. MCIMX6QP6AVT8AA | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6QP | Tray | Active | -40°C ~ 125°C (TJ) | Surface Mount | 624-FBGA, FCBGA | MCIMX6 | 624-FCBGA (21x21) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 60 | ARM® Cortex®-A9 | 852MHz | 4 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, DDR3L, DDR3 | Yes | HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel | 10/100/1000Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS | CAN, EBI/EMI, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART | |||||||||||||||||||||||||||
| NXP USA Inc. MCIMX6QP7CVT8AA | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6QP | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 624-FBGA, FCBGA | MCIMX6 | 624-FCBGA (21x21) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 60 | ARM® Cortex®-A9 | 800MHz | 4 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, DDR3L, DDR3 | Yes | HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel | 10/100/1000Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS | CAN, EBI/EMI, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART | |||||||||||||||||||||||||||
| NXP USA Inc. MCIMX6DP4AVT1AA | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6DP | Tray | Active | -40°C ~ 125°C (TJ) | Surface Mount | 624-FBGA, FCBGA | MCIMX6 | 624-FCBGA (21x21) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 60 | ARM® Cortex®-A9 | 1.0GHz | 2 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, DDR3L, DDR3 | Yes | HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel | 10/100/1000Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS | CAN, EBI/EMI, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART | |||||||||||||||||||||||||||
| NXP USA Inc. MCIMX6DP6AVT8AA | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6DP | Tray | Active | -40°C ~ 125°C (TJ) | Surface Mount | 624-FBGA, FCBGA | MCIMX6 | 624-FCBGA (21x21) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935312751557 | 5A992C | 8542.31.0001 | 60 | ARM® Cortex®-A9 | 852MHz | 2 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, DDR3L, DDR3 | Yes | HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel | 10/100/1000Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS | CAN, EBI/EMI, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART | ||||||||||||||||||||||||||
| NXP USA Inc. MCIMX6DP4AVT8AA | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6DP | Tray | Active | -40°C ~ 125°C (TJ) | Surface Mount | 624-FBGA, FCBGA | MCIMX6 | 624-FCBGA (21x21) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935322521557 | 5A992C | 8542.31.0001 | 60 | ARM® Cortex®-A9 | 852MHz | 2 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, DDR3L, DDR3 | Yes | HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel | 10/100/1000Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS | CAN, EBI/EMI, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART | ||||||||||||||||||||||||||
| NXP USA Inc. MCIMX6DP5EYM1AA | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6DP | Tray | Active | -20°C ~ 105°C (TJ) | Surface Mount | 624-LFBGA, FCBGA | MCIMX6 | 624-FCPBGA (21x21) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 60 | ARM® Cortex®-A9 | 1.0GHz | 2 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, DDR3L, DDR3 | Yes | HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel | 10/100/1000Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS | CAN, EBI/EMI, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART | |||||||||||||||||||||||||||
| NXP USA Inc. TEF6638HW/V106ZK | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Active | - | - | Surface Mount | 100-TQFP Exposed Pad | - | TEF6638 | - | - | - | 100-HTQFP (14x14) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 450 | - | - | - | - | - | - | ||||||||||||||||||||||||||||||
| NXP USA Inc. LS1012ASE7EKA | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | QorIQ® Layerscape | Tray | Active | 0°C ~ 105°C | Surface Mount | 211-VFLGA | LS1012 | 211-FCLGA (9.6x9.6) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A002A1 FRE | 8542.31.0001 | 168 | ARM® Cortex®-A53 | 600MHz | 1 Core, 64-Bit | - | DDR3L | - | - | GbE (2) | SATA 6Gbps (1) | USB 2.0 (1), USB 3.0 + PHY | - | Secure Boot, TrustZone® | - | |||||||||||||||||||||||||||
| NXP USA Inc. MCF51AC128CCFGE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MCF51AC | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 44-LQFP | MCF51 | 44-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 160 | 36 | Coldfire V1 | 32-Bit Single-Core | 50MHz | I²C, SCI, SPI | LVD, PWM, WDT | 128KB (128K x 8) | FLASH | - | 16K x 8 | 2.7V ~ 5.5V | A/D 9x12b | External | |||||||||||||||||||||||||||
| NXP USA Inc. MCHC11F1VFNE4R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HC11 | Tape & Reel (TR) | Obsolete | -40°C ~ 105°C (TA) | Surface Mount | 68-LCC (J-Lead) | MCHC11 | 68-PLCC (24.21x24.21) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935314607518 | EAR99 | 8542.31.0001 | 250 | 30 | HC11 | 8-Bit | 4MHz | SCI, SPI | POR, WDT | - | ROMless | 512 x 8 | 1K x 8 | 4.75V ~ 5.25V | A/D 8x8b | Internal | |||||||||||||||||||||||||||
| NXP USA Inc. MK22FN512VFX12 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K20 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 88-VFQFN Exposed Pad | MK22FN512 | 88-QFN (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935313138557 | 5A002A1 | 8542.31.0001 | 840 | 60 | ARM® Cortex®-M4 | 32-Bit Single-Core | 120MHz | I²C, IrDA, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 512KB (512K x 8) | FLASH | - | 128K x 8 | 1.71V ~ 3.6V | A/D 2x16b; D/A 1x12b | Internal | ||||||||||||||||||||||||||
| NXP USA Inc. MK22FN512VFX12R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K20 | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 88-VFQFN Exposed Pad | MK22FN512 | 88-QFN (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 1,500 | 60 | ARM® Cortex®-M4 | 32-Bit Single-Core | 120MHz | I²C, IrDA, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 512KB (512K x 8) | FLASH | - | 128K x 8 | 1.71V ~ 3.6V | A/D 2x16b; D/A 1x12b | Internal | |||||||||||||||||||||||||||
| NXP USA Inc. MKS20FN128VFT12 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KS22 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 48-VFQFN Exposed Pad | MKS20FN128 | 48-QFN (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935316479557 | 5A002A1 | 8542.31.0001 | 260 | 35 | ARM® Cortex®-M4 | 32-Bit Single-Core | 120MHz | CANbus, I²C, SPI, UART/USART, USB OTG | Brown-out Detect/Reset, DMA, I²S, LVD, POR, PWM, WDT | 128KB (128K x 8) | FLASH | - | 64K x 8 | 1.71V ~ 3.6V | A/D 1x16b; D/A 1x12b | Internal | ||||||||||||||||||||||||||
| NXP USA Inc. MKS20FN256VFT12 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KS22 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 48-VFQFN Exposed Pad | MKS20FN256 | 48-QFN (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935316481557 | 5A002A1 | 8542.31.0001 | 260 | 35 | ARM® Cortex®-M4 | 32-Bit Single-Core | 120MHz | CANbus, I²C, SPI, UART/USART, USB OTG | Brown-out Detect/Reset, DMA, I²S, LVD, POR, PWM, WDT | 256KB (256K x 8) | FLASH | - | 64K x 8 | 1.71V ~ 3.6V | A/D 1x16b; D/A 1x12b | Internal | ||||||||||||||||||||||||||
| NXP USA Inc. MKS22FN256VFT12 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KS22 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 48-VFQFN Exposed Pad | MKS22FN256 | 48-QFN (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A002A1 | 8542.31.0001 | 260 | 35 | ARM® Cortex®-M4 | 32-Bit Single-Core | 120MHz | CANbus, I²C, SPI, UART/USART, USB OTG | Brown-out Detect/Reset, DMA, I²S, LVD, POR, PWM, WDT | 256KB (256K x 8) | FLASH | - | 64K x 8 | 1.71V ~ 3.6V | A/D 1x16b; D/A 1x12b | Internal | |||||||||||||||||||||||||||
| NXP USA Inc. S908AB32AE2MFUE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HC08 | Bulk | Not For New Designs | -40°C ~ 125°C (TA) | Surface Mount | 64-QFP | S908 | 64-QFP (14x14) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935321652557 | EAR99 | 8542.31.0001 | 420 | 51 | HC08 | 8-Bit | 8MHz | SCI, SPI | POR, PWM | 32KB (32K x 8) | FLASH | 512 x 8 | 1K x 8 | 4.5V ~ 5.5V | A/D 8x8b | Internal | |||||||||||||||||||||||||||
| NXP USA Inc. S908AB32AH3VFUE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HC08 | Bulk | Not For New Designs | -40°C ~ 105°C (TA) | Surface Mount | 64-QFP | S908 | 64-QFP (14x14) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935310646557 | EAR99 | 8542.31.0001 | 420 | 51 | HC08 | 8-Bit | 8MHz | SCI, SPI | POR, PWM | 32KB (32K x 8) | FLASH | 512 x 8 | 1K x 8 | 4.5V ~ 5.5V | A/D 8x8b | Internal | |||||||||||||||||||||||||||
| NXP USA Inc. S912DT12PE2MPVER | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HC12 | Tape & Reel (TR) | Not For New Designs | -40°C ~ 125°C (TA) | Surface Mount | 112-LQFP | S912 | 112-LQFP (20x20) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935323135528 | EAR99 | 8542.31.0001 | 500 | 67 | CPU12 | 16-Bit | 8MHz | CANbus, I²C, SCI, SPI | POR, PWM, WDT | 128KB (128K x 8) | FLASH | 2K x 8 | 8K x 8 | 4.5V ~ 5.5V | A/D 16x8/10b | Internal | |||||||||||||||||||||||||||
| NXP USA Inc. S912DT12PE2VPVER | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HC12 | Tape & Reel (TR) | Not For New Designs | -40°C ~ 105°C (TA) | Surface Mount | 112-LQFP | S912 | 112-LQFP (20x20) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935314525528 | EAR99 | 8542.31.0001 | 500 | 67 | CPU12 | 16-Bit | 8MHz | CANbus, I²C, SCI, SPI | POR, PWM, WDT | 128KB (128K x 8) | FLASH | 2K x 8 | 8K x 8 | 4.5V ~ 5.5V | A/D 16x8/10b | Internal | |||||||||||||||||||||||||||
| NXP USA Inc. S912ZVCA64F0WKH | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Automotive, AEC-Q100, S12 MagniV | Bulk | Active | -40°C ~ 150°C (TA) | Surface Mount | 64-LQFP Exposed Pad | S912 | 64-HLQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935323896557 | 3A001A2A | 8542.31.0001 | 800 | 42 | S12Z | 16-Bit | 32MHz | CANbus, I²C, SCI, SPI | DMA, POR, PWM, WDT | 64KB (64K x 8) | FLASH | 1K x 8 | 4K x 8 | 3.5V ~ 40V | A/D 16x12b; D/A 1x8b | Internal | ||||||||||||||||||||||||||
| NXP USA Inc. S912ZVL64F0VLF | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S12 MagniV | Bulk | Active | -40°C ~ 105°C (TA) | Surface Mount | 48-LQFP | S912 | 48-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935316497557 | 3A991A2 | 8542.31.0001 | 1,250 | 34 | S12Z | 16-Bit | 32MHz | CANbus, I²C, IrDA, LINbus, SCI, SPI, UART/USART | LVD, POR, PWM, WDT | 64KB (64K x 8) | FLASH | 512 x 8 | 1K x 8 | 5.5V ~ 18V | A/D 10x10b | Internal | ||||||||||||||||||||||||||
| NXP USA Inc. S912ZVLA12F0MLF | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S12 MagniV | Tray | Active | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP | S912 | 48-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 1,250 | 34 | S12Z | 16-Bit | 32MHz | CANbus, I²C, IrDA, LINbus, SCI, SPI, UART/USART | LVD, POR, PWM, WDT | 128KB (128K x 8) | FLASH | 512 x 8 | 1K x 8 | 5.5V ~ 18V | A/D 10x10b; D/A 1x8b | Internal | |||||||||||||||||||||||||||
| NXP USA Inc. S912ZVLA64F0MLF | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S12 MagniV | Bulk | Active | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP | S912 | 48-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935323895557 | 3A991A2 | 8542.31.0001 | 1,250 | 34 | S12Z | 16-Bit | 32MHz | CANbus, I²C, IrDA, LINbus, SCI, SPI, UART/USART | LVD, POR, PWM, WDT | 64KB (64K x 8) | FLASH | 512 x 8 | 1K x 8 | 5.5V ~ 18V | A/D 10x10b; D/A 1x8b | Internal | ||||||||||||||||||||||||||
| NXP USA Inc. S9S08DV16F2MLF | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tray | Active | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP | S9S08 | 48-LQFP (7x7) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935326084557 | 3A991A2 | 8542.31.0001 | 250 | 39 | S08 | 8-Bit | 40MHz | CANbus, I²C, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 16KB (16K x 8) | FLASH | - | 1K x 8 | 2.7V ~ 5.5V | A/D 16x12b | External | |||||||||||||||||||||||||||
| NXP USA Inc. SC68376BGMAB20R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | M683xx | Tape & Reel (TR) | Not For New Designs | -40°C ~ 125°C (TA) | Surface Mount | 160-BQFP | SC68376 | 160-QFP (28x28) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935319463528 | EAR99 | 8542.31.0001 | 200 | 18 | CPU32 | 32-Bit Single-Core | 20MHz | CANbus, EBI/EMI, SCI, SPI | POR, PWM, WDT | - | ROMless | - | 7.5K x 8 | 4.75V ~ 5.25V | A/D 16x10b | External | |||||||||||||||||||||||||||
| NXP USA Inc. SC705C8AE0VFNE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tube | Obsolete | - | - | SC705C8 | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935325572574 | EAR99 | 8542.31.0001 | 26 | - | - | - | - | - | - | - | - | - | - | - | - | ||||||||||||||||||||||||||||||
| NXP USA Inc. SCF5249LAG133 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MCF524x | Bulk | Not For New Designs | 0°C ~ 70°C (TA) | Surface Mount | 144-LQFP | SCF5249 | 144-LQFP (20x20) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935321253557 | 3A991A2 | 8542.31.0001 | 300 | 34 | Coldfire V2 | 32-Bit Single-Core | 133MHz | I²C, IDE, Memory Card, SPI, UART/USART | DMA, I²S, POR, Serial Audio, WDT | - | ROMless | - | 96K x 8 | 3V ~ 3.6V | A/D 4x12b | External | |||||||||||||||||||||||||||
| NXP USA Inc. SCF5249VM140 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MCF524x | Bulk | Not For New Designs | 0°C ~ 70°C (TA) | Surface Mount | 160-BGA | SCF5249 | 160-MAPBGA (15x15) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 630 | 47 | Coldfire V2 | 32-Bit Single-Core | 140MHz | I²C, IDE, Memory Card, SPI, UART/USART | DMA, I²S, POR, Serial Audio, WDT | - | ROMless | - | 96K x 8 | 3V ~ 3.6V | A/D 4x12b | External |
